Broadcom Announces New SoC For Budget Devices, Offers Full HSPA+ And Jelly Bean Support

Sure we’ve seen some other chipmakers working on a few budget processors for the masses recently, but other manufacturers seem to have their sights set on the ever-growing budget market as well. And so following its earlier onslaught of mobile processors, Broadcom recently announced its BCM21664T chip, which is a specialized SoC featuring a 1.2GHz dual-core ARM Cortex A9 processor, a VideoCore GPU which can support 720P video recording and full 1080P video playback. The chipset is also optimized for
faux-g HSPA+ technology and should be able to haul in downstream speeds of up to 21.1Mbps and upstream speeds of up to 5.8Mbps. Oh and best of all— Broadcom’s new SoC is specially optimized for Jelly Bean— specifically the newest Jelly Bean version. Very exciting news indeed.

So now that the chipset has been announced, we’re sure that many of you are eagerly awaiting the development of new budget-level devices featuring Jelly Bean running the show. Hopefully we don’t need to wait too long to see the first devices start to trickle down.

Hit the break the see Broadcom’s full presser.

Broadcom Extends Family of 3G Smartphone Platforms for Android

Introduces Industry’s First Dual-Core HSPA+ Processor for Entry-Level Smartphones

IRVINE, Calif., Dec. 4, 2012

Dual ARM Cortex A9 and VideoCore® graphics provide fast computing power and unsurpassed multimedia performance at affordable price point
Complete turnkey design integrates Broadcom’s newest cellular baseband with advanced connectivity suite including Wi-Fi, Bluetooth, GPS and NFC
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced its newest smartphone platform optimized for the Android 4.2 Jelly Bean operating system (OS). Powered by the BCM21664T 1.2GHz HSPA+ cellular baseband, the 3G platform delivers strong performance capabilities at faster data speeds. The BCM21664T and its turnkey design features the industry’s first dual-core HSPA+ processor for affordable smartphones and integrates Broadcom’s leading connectivity suite, previously available only on higher-end Android devices. For more news, visit Broadcom’s Newsroom.

The appetite for affordable smartphones has grown in parallel to the demand for increased functionality and a superior mobile broadband experience that provides users with the ability to concurrently run apps, download files and share and stream content. The new BCM21664T platform brings together the processing power of a dual core ARM Cortex A9 with increased graphics and imaging capabilities to enhance the Android 4.2 experience. The chip is supported by radio frequency (RF), a power management unit (PMU) and an advanced connectivity suite for a complete system solution.

Key Features:

21.1 Mbps (Megabits per second) of downstream connectivity, 5.8 Mbps of upstream connectivity
Graphics features of 720p HD recording and full 1080p playback supported by over 20GFLOPS of graphics processing capacity
Miracast enabled for HD playback over wireless
Industry leading, lowest power 3G/2G dual SIM-dual standby to enable global markets
Complete reference design including schematics, tools, software and carrier specific features
Availability

The BCM21664T is currently sampling with volume production expected early in the second quarter of 2013.

For ongoing news, visit Broadcom’s Newsroom, read the B-Connected Blog, or visit Facebook or Twitter. And to stay connected, subscribe to Broadcom’s RSS Feed.

Quotes:

Jeff Orr, Practice Director, Devices & Applications at ABI Research

“The expanding Android ecosystem combined with the complete platform approach championed by semiconductor manufacturers like Broadcom has helped put affordable, high-performing smartphones within reach of an even larger pool of consumers. By adding an advanced processor with HSPA+ enabled technology to its portfolio of 3G smartphone platforms, Broadcom will deliver an improved Android Jelly Bean experience that allows users to share and connect in meaningful ways.”

Rafael Sotomayor, Vice President, Mobile Platform Solutions

“As the first dual-core, HSPA+ enabled platform for entry-level Android smartphones, BCM21664T provides not only a better mobile experience at faster download speeds, but also establishes a new standard in performance for the growing base of low-cost smartphones. Mainstream consumers will continue to seek affordable smartphones and the user experience expectations of these devices will continue to grow. Broadcom’s new chipset platform will help handset manufacturers deliver this enhanced functionality at new price points and capitalize on the expansion of the mobile internet.”